Osram Opto Semiconductors has formed an alliance with seven partners in the scientific and industry sectors. From December 2014 to February 2018, it participated in the InteGreat research project sponsored by the German Federal Ministry of Education and Research (BMBF) to conduct an in-depth study of current LED production. Process methods and related technologies to improve part of the manufacturing process.
OSRAM launches flat interconnect technology, source: OSRAM
In the process of participating in the research, seven manufacturers conducted in-depth research on small LED chips for surface illumination and packaging technology to find alternatives, the most important of which are wafer-level packaging technology and research on planar contacts.
Through this program, researchers have developed a number of new technologies, one of which is the planar interconnect technology, which replaces the bonding wires with thin, flat metal wires, allowing the surface-emitting LEDs to be moved to the surface of the package to effectively improve luminous efficiency. Reduce the cost of use.
The research results can be applied to R&D products and production, and integrate LED in industrial applications to promote mobility in future applications, not only for large-size TV walls, but also for surround lighting and sensing systems. Can drive the information entertainment to potential market.
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