Package structure type:
Leaded package
The LED foot package uses lead frames as pins for various package types. It is the first package structure successfully developed on the market. The variety of products is high, the technology maturity is high, and the structure and reflective layer inside the package are still being improved. Standard LEDs are considered by most customers to be the most convenient and economical solution in the display industry. Typical LEDs are housed in an enclosure that can withstand 0.1W of input power, 90% of which is pinned by the negative pole. The rack is distributed to the PCB and then released into the air. How to reduce the temperature rise of the pn junction during operation is a must for packaging and application.
Surface mount package
Surface mount packaged LEDs (SMD LEDs) are accepted by the market and gain a certain market share. The shift from lead package to SMD is in line with the development trend of the entire electronics industry, and many manufacturers have introduced such products.
Most of the early SMD LEDs were SOT-23 modified with a transparent plastic body, and the reel-type container was taped. On the basis of SOT-23, the former is monochromatic illumination, and the latter is bi-color or tri-color illumination. In recent years, SMD LED has become a development hotspot, which solves the problems of brightness, viewing angle, flatness, reliability, consistency, etc., using lighter PCB board and reflective layer material, which needs to be filled in the reflective layer. Fewer epoxy resin and remove the heavier carbon steel material pins. By reducing the size and weight, you can easily reduce the weight of the product by half, and finally make the application perfect. Especially suitable for indoor, semi-outdoor full color display. Screen application.
Power package
The LED chip and package are developed in the direction of high power. Under the high current, the luminous flux is 10-20 times larger than that of the Φ5mm LED . The effective heat dissipation and non-degraded packaging materials must be used to solve the light decay problem. Therefore, the package and the package are also the key. Technology, LED packages that can withstand several W power have emerged. 5W series white, green, blue green, blue power LEDs have been available since the beginning of 2003. The white LED light output reaches 1871lm, the light efficiency is 44.31lm/W green light decay problem, and the LED that can withstand 10W power is developed. The area tube; the size of the crucible is 2.5×2.5mm, it can work under the current of 5A, and the light output reaches 2001lm. It has great development space as a solid illumination source.
The thermal characteristics of power LEDs directly affect the operating temperature, luminous efficiency, wavelength of illumination, and lifetime of LEDs. Therefore, the packaging design and manufacturing technology of power LED chips are particularly important.
COB type package
The COB package can directly package multiple chips on the metal-based printed circuit board MCPCB, and directly dissipate heat through the substrate, which not only reduces the manufacturing process and cost of the bracket, but also has the advantage of reducing heat dissipation.
From the perspective of cost and application, COB has become the mainstream of future lighting design. The LED module of the COB package has a plurality of LED chips mounted on the substrate. The use of multiple chips not only improves the brightness, but also facilitates the rational configuration of the LED chips and reduces the input current of the individual LED chips to ensure high efficiency. Moreover, the surface light source can greatly expand the heat dissipation area of ​​the package, so that heat can be more easily conducted to the outer casing.
Technology Introduction:
1. Expand the crystal, and open the densely packed wafers to facilitate the solid crystal.
2, solid crystal, conductive / non-conductive glue at the bottom of the bracket (conductivity depends on whether the wafer is a top or bottom PN junction or a left and right PN junction) and then put the wafer into the bracket.
3. Short baking, so that the wafer does not move when the glue cures the wire.
4. Solder wire, use gold wire to turn on the wafer and the bracket.
5, before the test, the initial test can not be bright.
6. Glue the glue and wrap the chip and the bracket with glue.
7, long baked, let the glue solidify.
8, after the test, the test can be bright or not and the electrical parameters are up to standard.
9. Splitting and separating the colors, and separating the products whose colors and voltages are roughly the same.
10. Packaging.
Four LED innovative packaging technologies:
In recent years, with the popularization of LED lighting and the expansion of LED display applications, the market has also put forward new requirements for LED packaging technology. Let's take a look at some of the gratifying achievements in the field of LED packaging.
Straight three-in-one
Recently, Shenzhen Jinhuaguang Technology Co., Ltd. introduced a three-in-one package technology, which allows the industry to see the dawn of LED display packaging technology innovation.
According to Jin Huaguang Technology Guo Jianliang, Sanhe has been inserted into the upgraded products of the current in-line products. It has not changed the packaging process of traditional direct-inserted lamps, but it has broken through in product structure and combination, and sealed RGB in a lamp. Four lamp feet. “Traditional full-color requires three single lamps as a phase point. Now, as long as one single lamp can achieve the same effect, the production and material costs are greatly reduced, and the product has excellent price competitiveness.†The outdoor in-line three-in-one solves the dilemma that the user's display performance and weather resistance cannot be combined.
Piranha
The piranha LED is a packaged, square, transparent resin package with four pins and a missing LED at the negative pole. The piranha is an astigmatic LED with an illumination angle greater than 120 degrees, a high luminous intensity, and the ability to withstand greater power. There are more brake lights and turn signals for the car. It is said that this kind of LED immediately attracted everyone's attention when it was just born. Its development trend is as fierce as the piranha. Another way of saying it is because it looks like a piranha in the Amazon.
The piranha series display is a three-in-one entangled lamp between the traditional straight-line lamp and the traditional indoor surface-mounted lamp. Compared with the traditional outdoor 246, 346 straight-line lamp, the piranha series 5353 High brightness, excellent white balance, large viewing angle, red, green and blue wick synchronization, gold wire bonding, low failure rate, these are the biggest highlights of the piranha series. The full-color display outdoor protection level completed by the piranhas 5353 can reach IP65 or above. From the front/side, it eliminates the phenomenon of “flower-screen spots†that 246, 346, and 546 lamp beads have not been able to solve. The heat dissipation is better than that of the outdoor 3528, 5050 and other three-in-one lamp beads. According to industry insiders, the market prospect of outdoor triads has been more promising than the traditional in-line lamps and stickers.
COB
The Chip On Board (COB) process first covers the wafer placement point with a thermally conductive epoxy resin (usually an epoxy resin doped with silver particles) on the surface of the substrate, and then directly places the silicon wafer on the surface of the substrate, heat treatment. The silicon wafer is firmly fixed to the substrate, and then an electrical connection is directly established between the silicon wafer and the substrate by wire bonding.
If the bare chip is directly exposed to the air, it is susceptible to contamination or man-made damage, affecting or destroying the function of the chip, so the chip and the bonding wire are encapsulated by glue. This package is also referred to as a soft encapsulation.
COG
The LED packaging factory has completed the integrated packaging technology that can use different substrates. At present, the dual-throw sapphire substrate is used. Wang Qilong, chairman of Hongqi, pointed out that COG technology can be used to mark LED dies on different substrate materials according to customer needs. The newly developed sapphire substrate integrated packaging technology can increase the brightness by 30%. This COG product seals the LED on both sides of the glass or sapphire board. Because the color of the intermediate substrate is transparent, the LED light will be more uniform, and this product Omission of the stent process can reduce the cost of the stent product and simplify the process.
Ten LED packaging technology development trends
LED packaging industry as an important industry for the industry's important support and subsequent development of moisture-proof cabinets (also known as moisture-proof boxes, drying boxes, drying cabinets), is closely watched by major manufacturers. According to industry insiders, the future development of LED packaging technology is mainly to ten trends.
First, the medium power has become the mainstream packaging method. At present, most of the products on the market are high-power LED products or low-power LED products. Although they have their own advantages, they also have insurmountable defects. The medium-power LED products that combine the advantages of both have emerged as the mainstream packaging method.
Second, the application of new materials in packaging. Materials such as thermoset materials EMC, thermoplastic PCT, modified PPA, and ceramic-like plastics will be widely used due to higher and better environmental tolerances such as high temperature resistance, UV resistance, and low water absorption.
Third, the chip ultra-current density application. In the future, the chip's super current density will be 350MA/mm? Developed to 700MA/mm? Even higher. The chip demand voltage will be lower, a smoother VI curve (lower heat), and ESD and VF.
Fourth, the popularity of COB applications. With the advantages of low thermal resistance, good light quality, solder-free and low cost, COM applications will be widely used in the future.
Fifth, the demand for higher light quality. Mainly for indoor lighting, Jingtai Optoelectronics will use the LED indoor lighting product RA to reach 80 as the standard, and RA to achieve the goal of 90. Try to make the light color of the lighting product close to the Plank curve, so that the light can be even and glare-free. .
6. International and domestic standards are further improved. It is believed that with the continuous improvement of LED packaging technology, the quality standards for LED products in China and internationally will continue to improve.
Seven, integrated packaged light engine becomes a package value. The integrated packaged light engine will become the focus of the next season of the company.
Eight, go to the power solution (high voltage LED). In the future, indoor lighting will pay more attention to quality, and driven by cost factors, the power supply scheme will gradually become an acceptable product, and the high-voltage LED fully caters to the power-off scheme, but the need to solve the problem is that the chip reliability needs to be strengthened.
Nine, multi-color LED light source for scene lighting. Scenario lighting will be the core competitiveness of LED lighting, and the second take-off of future LED lighting needs to rely on scene lighting to achieve.
Ten, the light efficiency demand is relatively reduced, and the cost performance has become a magic weapon for the packaging factory. In the future, indoor lighting will not pay too much attention to light efficiency, but will pay more attention to the quality of light. With the improvement of packaging technology, the cost reduction of LED lamps has become the power to replace traditional lighting sources.
LED packages range from in-line LEDs to high-power LEDs, PLCC LEDs, ceramic packages, EMC packages, and the most popular chip-scale package CSPs. The evolution of technology continues around the theme of cost/performance (lm/$). .
The stringing pulley is divided into ground cable pulley, cable pulley, skyward pulley, nylon pulley, cable conductor stringing pulley, large-diameter stringing pulley, dual-purpose stringing pulley for hanging, ground wire stringing pulley and lifting pulley. It is mainly used to protect cables and conductors, saving time and labor.
According to the material, there are two kinds of aluminum wheel and MC nylon wheel, and the style is divided into tube type and plate type.
Application of large diameter stringing pulley: it is used to lead and stringing single conductor, double split conductor and four split conductor (the intermediate wheel can be cast steel wheel or nylon wheel), which is suitable for tension paying off.
Ground wire stringing pulley: it is suitable for extending lightning wires or crossing steel strands, including steel and MC nylon.
Special pulley for optical cable: it is used to lay OPGW composite ground wire optical cable or ADSS self-supporting optical cable. A small groove is equipped at the bottom of the wheel groove, which is specially manufactured to protect the optical cable; The wheel is made of MC nylon by die casting, which will not damage the outer skin of the optical cable during stringing.
Description:
1. We manufacture a lot of models for different uses in the overhead transmission line construction.
2. The stringing pulleys are used to support conductors, OPGW, ADSS, communication lines, etc.
3. The sheave of the Pulley Blocks are made from high strength MC nylon, or aluminum materials, and the frame of blocks are made of galvanized steel. The lateral ones are mounted on ball bearings.
4. According to the customer's demand, aluminium wheel or MC nylon wheel can be selected.
DDIN Standard Stringing Blocks,Universal Stringing Block
MARSHINE , https://www.puller-tensioner.com