On March 28th, the latest semiconductor design and expenditure analysis report released by market research organization IHS iSuppli pointed out that in 2013, the wireless field will be the main field of OEM semiconductor spending growth, and it is expected that semiconductor spending in this field will achieve double-digit growth In order to support the rapid growth of the market of smart phones, media tablets and mobile infrastructure equipment, this also brings huge opportunities to all parties in the industry chain.
In this regard, Mike Rayfield, vice president of Micron's wireless business unit, said that as one of the global semiconductor solution providers, storage technology is the foundation of Micron's business. Micron Technology has numerous storage products and solutions that can provide optimal service support for wireless mobile devices. As more smartphones and tablet products require greater memory storage capacity, Micron Technology will drive the continued healthy growth of the mobile semiconductor market in the next few years.
"This growth will first be reflected in the Chinese market, and Micron Technology will be committed to supporting China's rapid rise in the global mobile market." Mike Rayfield pointed out that in the era of mobile Internet, China's consumer electronics market is booming, surpassing the United States in 2012. The world's largest market. At the same time, with the development and commercialization of 4G worldwide, and the domestic TD-LTE industrialization, these mobile devices will usher in a new round of development upsurge, and will put forward higher application requirements for basic technologies such as chips and storage. .
Mike Rayfield said that Micron Technology's system engineering laboratory, which was officially put into operation in Shanghai at the end of November 2012, will definitely be deployed in applications such as network applications, smartphones and tablets. The diversified products and solutions provided by Micron Technology can meet the performance improvement of wireless mobile devices such as mobile phones and computers, the increase in memory requirements and the enhancement of functions, including DRAM, NAND flash memory, NOR flash memory and multi-chip packages PCM memory solution.
In addition, in order to consolidate the company's leading position in the storage field, in 2012, Micron Technology announced the acquisition of chip manufacturer Elpida (Elpida). When the acquisition is completed, Micron Technology will become the world's second largest DRAM chip manufacturer.
The USB 3.2 specification absorbed all prior 3.x specifications. USB 3.2 identifies three transfer rates – 20Gbps, 10Gbps, and 5Gbps.
Key characteristics of the USB 3.2 specification include:
Defines multi-lane operation for new USB 3.2 hosts and devices, allowing for up to two lanes of 10Gbps operation to realize a 20Gbps data transfer rate, without sacrificing cable length
Delivers compelling performance boosts to meet requirements for demanding USB storage, display, and docking applications
Continued use of existing USB physical layer data rates and encoding techniques
Minor update to hub specification to address increased performance and assure seamless transitions between single and two-lane operation
Improved data encoding for more efficient data transfer leading to higher through-put and improved I/O power efficiency
Backwards compatible with all existing USB products; will operate at lowest common speed capability
Usb 3.2 Cable,Usb Type-C Cable,5Gbps Usb Type-C Cable,10Gbps Usb Type-C Cable
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