LatTIce's ECP5/ECP5-5G family of FPGAs features high-performance features such as enhanced DSP architecture, high-speed SERDES and high-speed source-synchronous interfaces, FPGA lookups for 84K logic cells, up to 365 I/Os, and up to 156 18x18 Multiplier and a variety of parallel I/O Peugeot. Using 40nm process technology, it is very suitable for high-speed and low-cost applications such as automotive electronics and intelligent monitoring. This article introduces the main features of ECP5/ECP5-5G series FPGA, series selection table , LFE5UM / LFE5UM5G-85 device simplified block diagram and embedded video development kit, as well as ECP5 VIP processor board main features and circuit diagram and bill of materials.
The ECP5/ECP5-5G family of FPGA devices is opTImized to deliver high performance features such as an enhanced DSP architecture, high speed SERDES and high speed source synchronous interfaces in an economical FPGA fabric. This combinaTIon is achieved through advances in device architecture and the Use of 40 nm technology making the devices suitable for high-volume, high-speed, and low-cost applicaTIons.
The ECP5/ECP5-5G device family covers look-up-table (LUT) capacity to 84K logic elements and supports up to 365 user I/Os. The ECP5/ECP5-5G device family also offers up to 156 18 x 18 multipliers and a wide range of parallel I/O standards.
The ECP5/ECP5-5G FPGA fabric is optimized high performance with low power and low cost in mind. The ECP5/ ECP5-5G devices utilize reconfigurable SRAM logic technology and provide popular building blocks such as LUT-based logic, distributed and embedded memory, Phase Locked Loops (PLLs), Delay Locked Loops (DLLs), pre-engineered source synchronous I/O support, enhanced sysDSP slices and advanced configuration support, including encryption and dual-boot capabilities.
The pre-engineered source synchronous logic implemented in the ECP5/ECP5-5G device family supports a broad range of interface standards, including DDR2/3, LPDDR2/3, XGMII and 7:1 LVDS.
The ECP5/ECP5-5G device family also features high speed SERDES with dedicated Physical Coding Sublayer (PCS) functions. High jitter tolerance and low transmit jitter allow the SERDES plus PCS blocks to be configured to support an array of popular data protocols including PCI Express , telnet, and s.
The ECP5/ECP5-5G devices also provide flexible, reliable and secure configuration options, such as dual-boot capability, bit-stream encryption, and TransFR field upgrade features.
ECP5-5G family devices have made some enhancement in the SERDES compared to ECP5UM devices. These enhancements increase the performance of the SERDES to up to 5 Gb/s data rate.
The ECP5-5G family devices are pin-to-pin compatible with the ECP5UM devices. These allow a migration path for users to port designs from ECP5UM to ECP5-5G devices to get higher performance.
The Lattice DiamondTM design software allows large complex designs to be consumed implemented using the ECP5/ECP5-5G FPGA family. Synthesis library support for ECP5/ECP5-5G devices is available for popular logic synthesis tools. The Diamond tools use the synthesis tool output Along with the constraints from its floor planning tools to place and route the design in the ECP5/ECP5-5G device. The tools extract the timing from the routing and back-annotate it into the design for timing verification.
Lattice provides many pre-engineered IP (Intellectual Property) modules for the ECP5/ECP5-5G family. By using these configurable soft core IPs as standardized blocks, designers are free to concentrate on the unique aspects of their design, increasing their productivity.
Key features of ECP5 FPGA:
ï‚· Higher Logic Density for Increased System Integration
ï‚· 12K to 84K LUTs
ï‚· 197 to 365 user programmable I/Os
ï‚· Embedded SERDES
ï‚· 270 Mb/s, up to 3.2 Gb/s, SERDES interface (ECP5)
ï‚· 270 Mb/s, up to 5.0 Gb/s, SERDES interface (ECP5-5G)
ï‚· Supports eDP in RDR (1.62 Gb/s) and HDR (2.7 Gb/s)
ï‚· Up to four channels per device: PCI Express, Ethernet (1GbE, SGMII, XAUI), and CPRI
ï‚· sysDSPTM
ï‚· Fullycascadable slice architecture
ï‚· 12 to 160 slices for high performance multiply and accumulate
ï‚· Powerful 54-bit ALU operations
ï‚· Time Division Multiplexing MAC Sharing
ï‚· Rounding and truncation
ï‚· Each slice supports
ï‚· Half 36 x 36, two 18 x 18 or four 9 x 9 multipliers
ï‚· Advanced 18 x 36 MAC and 18 x 18 Multiply-Multiply-Accumulate (MMAC) operations
ï‚· Flexible Memory Resources
ï‚· Up to 3.744 Mb sysMEMTM Embedded BlockRAM (EBR)
ï‚· 194K to 669K bits distributed RAM
ï‚· sysCLOCK Analog PLLs and DLLs
ï‚· Four DLLs and four PLLs in LFE5-45 and LFE5-85; two DLLs and two PLLs in LFE5-25 and LFE5-12
ï‚· Pre-Engineered Source Synchronous I/O
ï‚· DDR registers in I/O cells
ï‚· Dedicated read/write levelling functionality
ï‚· Dedicated gearing logic
ï‚· Source synchronous standards support
ï‚· ADC/DAC, 7:1 LVDS, XGMII
 High Speed ​​ADC/DAC devices
ï‚· Dedicated DDR2/DDR3 and LPDDR2/LPDDR3 memory support with DQS logic, up to 800 Mb/s data-rate
ï‚· Programmable sysI/OTM Buffer Supports Wide Range of Interfaces
ï‚· On-chip termination
ï‚· LVTTL and LVCMOS 33/25/18/15/12
ï‚· SSTL 18/15 I, II
ï‚· HSUL12
ï‚· LVDS, Bus-LVDS, LVPECL, RSDS, MLVDS
ï‚· subLVDS and SLVS, MIPI D-PHY input interfaces
ï‚· Flexible Device Configuration
ï‚· Shared bank for configuration I/Os
ï‚· SPI boot flash interface
ï‚· Dual-boot images supported
ï‚· Slave SPI
ï‚· TransFRTM I/O for simple field updates
ï‚· Single Event Upset (SEU) Mitigation Support
 Soft Error Detect – Embedded hard macro
 Soft Error Correction – Without stopping user operation
 Soft Error Injection – Emulate SEU event to debug system error handling
ï‚· System Level Support
ï‚· IEEE 1149.1 and IEEE 1532 compliant
ï‚· Reveal Logic Analyzer
ï‚· On-chip oscillator for initialization and general use
ï‚· 1.1 V core power supply for ECP5, 1.2 V core power supply for ECP5UM5G
ECP5 and ECP5-5G series selection table:
Figure 1. Simplified block diagram of the LFE5UM/LFE5UM5G-85 device
Embedded video development kit
The kit is pre-programmed to demonstrate the Dual CSI-2 to HDMI demo. The dual camera inputs are received by the CrossLinkpASSP, which merges into a single video stream fed to the ECP5 FPGA. The ECP5 converts the incoming image into parallel data and And performs basic image processing, and then passes it to the HDMI VIP Output Bridge Board which converts the data to HDMI format. The output can be observed on a standard HDMI monitor.
Embedded video development kits include:
Three-board connected kit consisting of:
Crosslink VIP Bridge Board
ECP5 VIP Processor Board
HDMI VIP Output Bridge Board
USB mini cable for programming
12V AC adaptor Power Supply
QuickStart Guide
Lattice Diamond software license request letter with unique serial number.
The following hardware is not included with this kit but required to complete this demo
HDMI-capable monitor
HDMI cable
Figure 2. Outline of the embedded video development kit combination
Embedded vision offers a promising future with many exciting new applications entering the market. These systems are used in industrial display systems for M2M applications and for Industry 4.0 implementations, Advanced Driver Assistance Systems (ADAS) and infotainment applications for automotive, DSLR cameras, drones, Robotics, virtual reality (VR) systems, and medical equipment.
Lattice's product portfolio offers flexible solutions to address today's embedded vision designer's needs, such as evolving interface requirements, energy-efficient image signal processing and hardware acceleration.
Let Lattice and its partners help you create flexible and power-efficient solutions for Embedded Vision Processing at the Edge.Embedded Vision Systems
The implementations of object recognition, depth perception, collision avoidance and decision making are penetrating the devices in our homes, cities, factories and cars. Computing at the Edge requires a Consumer of industrial working industries are looking at FPGAs to help them create a flexible and intelligent learning environment to realize this future.
ECP5 VIP processor board
Lattice VIP boards can be interconnected to create solutions for MIPI® CSI-2/DSI, SERDES, LVDS and more.
The content of this user guide includes descriptions of onboard jumper settings, programming circuit, a complete set of schematic, and bill of materials for ECP5 VIP processor board.
Main features of ECP5 VIP processor board:
ï‚· ECP5/5 G
SERDES interface
Dual DDR3 interface
LVDS/MIPI Transmitter/Receiver interface
SPI flash configuration
General Purpose Input/Output
Programming Circuit
Mini-B USB connector to FTDI
FTDI to ECP5 using JTAG
FTDI to ispClock using JTAG
ispClock
SERDES reference clock generation interface
Figure 3. Outline drawing and main components of the ECP5 VIP processor board (front)
Figure 4. ECP5 VIP processor board outline drawing and main components (back)
Figure 5. Block diagram of the ECP5 VIP processor board
Figure 6. Circuit diagram of the ECP5 VIP processor board (1): FTDI and programmable interface
Figure 7. Circuit diagram of the ECP5 VIP processor board (2): Power regulator interface
Figure 8. Circuit diagram of the ECP5 VIP processor board (3): MIPI and GPIO connector interface
Figure 9. Circuit diagram of the ECP5 VIP processor board (4): DDR3 interface
Figure 10. Circuit diagram of the ECP5 VIP processor board (5): SERDES interface
Figure 11. ECP5 VIP Processor Board Circuit Diagram (6): ECP5 Decoupling Capacitor
Figure 12. ECP5 VIP Processor Board Circuit Diagram (7): HISPI/CSI2 Connector
ECP5 VIP processor board bill of materials:
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