TE introduces the Sliver interconnect solution with high performance, flexibility, and low cost. It has been adopted by the SNIA SFF TWG Technology Alliance as the specification for the SFF-TA-1002 multi-channel high-speed connector. Several industry groups, including On-Board Optics (COBO), Gen-Z Alliance (Gen-Z), Open Computing Project (OCP), and Enterprise and Data Center SSD Working Group (EDSFF), have adopted Sliver internal wiring and cards. Edge interconnect products serve as standardized connectors for their servers, storage devices and network designs.
The Sliver internal cable interconnect system provides a solution to the challenges of increased data rates. It is flexible and provides the best signal integrity while saving space and reducing design costs. With a terminal pitch of only 0.6 mm, Sliver products are ultra-slim and can be inserted deeper into the junction box. In addition to the card edge plug-in structure, we also provide a highly reliable metal housing design for the connector cage housing to help with cable pull, while the movable latch further enhances connection security. This new connectivity technology eliminates the need for retimers and lower-loss but more expensive PCB materials, and uses TE high-speed cables for speeds of up to 25 Gbps, simplifying design and helping reduce overall cost.
In addition, it features a rate of up to 112G PAM-4 (56G NRZ), PCIe Gen3/4 (8G & 16G), SAS-3/4 (6G, 12G and 24G), Ethernet protocol (10G & 25G per channel), All current protocol performance requirements for InfiniBand (28G) are expected to meet the performance requirements of IEEE & OIF 56 Gbps, PCIE Gen5 and SAS-5. Specifications include 1C (x4), 2C (x8), and 4C (x16) for right and vertical dimensions. All module cards can be plugged and matched to each other.
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