Rick Hemond and Ding Shuji, two industry experts from Dow DuPont Electronics and Imaging Division, will be present at the Industry and Technology Investment Forum (TIIF) organized by SIP Industry Innovation Investment Platform (SIIP China) this year, which will be held on March 15, 2018. Day (Thursday) held during SEMICONChina.
Rick Hemond is the Chief Marketing Officer (CMO) of the Electronics and Imaging Division of Dow DuPont Specialty Products, where he will discuss the potential impact of artificial intelligence (ArTIficial Intelligence) on future economic growth, emphasizing that electronic materials will play a role in future semiconductor manufacturing. The important role and success of artificial intelligence.
“Real and transformative new technologies will create significant growth opportunities,†Rick Hemond said. “With a wide range of technologies, from machine and deep learning, big data and cloud computing and automation, artificial intelligence has the power to create smart machines. And manufacturing, smart environments and products that increase productivity and efficiency to achieve higher growth and economic value. In software and hardware, including high-performance electronics and integrated devices, for the development and implementation of artificial intelligence-based applications important."
Ding Shuji is the Global Lithography Technology Director and Head of China Business Development of the Electronics and Imaging Division of Dow DuPont Specialty Products Business Unit. She will participate in the SIIP titled “Technology Innovation and Investment in China's Semiconductor Equipment and Materials Developmentâ€. group discussion. Ding Shuji will share her views on the development opportunities of China's semiconductor industry. In particular, she highlighted the importance of further investment by Chinese and global companies in China. Companies must demonstrate their ability to manufacture on a large scale while investing in technology, manufacturing capabilities and quality-focused design.
TIIF is a brand event of SIIP China and is held concurrently with SEMICOM China. TIIF 2018 will focus on recent policy changes, review current industry status, analyze capital flows and predict future growth. This year's conference theme will focus on artificial intelligence, as well as investment and M&A activities in the field of semiconductor equipment and materials.
As an honorary sponsor of SIIP China, Dow DuPont congratulates SEMICOM China on its 30th anniversary, which has a rich history of technology development and promotes the industry's development to this day.
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